Just a few months ago Samsung faced the Note 7 Fire Catching issue. As many of you already know, this issue was caused by the over-sized Battery in the device. Now, this issue is not there in the S8 or S8 Plus but, looks like Samsung is looking for a permanent solution to avoid these kind of problems in the Future.
This is where SLP or SLPCB (Substrate Like Printed Circuit Board) comes in. According to recent reports Samsung may use SLP technology in there future Smartphone Motherboards & the Galaxy S9 may be the first Smartphone to ship with it. Take a look at this design approach below,
So basically what this technology does is that, it adds support for extra layers of materials & often end up being much thinner compared to the regular PCBs available at this time. SLP can also take better advantage of the new gen smaller chips as it allows connections as thin as 15nm or less.
This will translate to way thinner Motherboards in their upcoming smartphones. This’ll also minimize the risk of having a Bigger Battery in a compact form factor. Even we can expect really thin systems with huge batteries inside them. So, it’s a clear indication of the fact that, In future, Smartphones will get thinner & more compact while keep getting powerful as well.
Can Samsung do it ? What do you guys think ? Let us know in the comment section write below this article !